Cooling Versatility Everywhere Thermal Pad Pro Cooler Master's new Thermal Pad Pro is an innovative solution to device cooling for a vast range of your electronic devices and components. Formulated with Nano Diamond Particles 15.3w/mK thermal conductivity for rapid cooling, capable of drawing high levels of heat. Non-toxic and Non-corrosive Safe and simple formula with electrically insulated and heat resistant properties to prevent hardening. Double-sided Adhesive Provides seamless and secure contact between surfaces. Wide Range of Application Electronic devices, motherboards, components (CPU, GPU, USICS, Hard Drives, Disk Drives, IGBT module), laptops and various products requiring cooling. Versatile and Easy Application Easily cut to the perfect size for your application. Choices of 1mm and 2mm thickness are available. More information: Features | Type | Thermal pad |  | Thermal conductivity | 15.3 W/m·K | | Density | 3.4 g/cm³ | | Product colour | Blue | | Non-corrosive | Yes | | Non-toxic | Yes | | Operating temperature (T-T) | -40 - 200 °C | Logistics data | Master (outer) case width | 200 mm | | Master (outer) case height | 195 mm | Packaging data | Package width | 170 mm | | Package depth | 82 mm | | Package height | 3 mm | | Package weight | 24 g | Weight & dimensions | Width | 45 mm | | Depth | 95 mm | | Height | 2 mm | | Weight | 17 g | Technical details | Hardness (Shore OO scale) | 55 | | Breakdown voltage | 6000 V |
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