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| Item number:
CIEN6-101629926 Manufacturer no.:
TS512GMTE370T EAN/GTIN:
n/a |
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| Transcend's M.2 2230 SSD MTE370T features state-of-the-art 3D NAND technology, which allows 112 layers of 3D NAND flash chips to be vertically stacked. This density breakthrough greatly improves storage efficiency. The MTE370T features the PCI Express (PCIe) Gen 3 x4 interface and is compatible with NVM Express (NVMe) 1.3 specifications to achieve never-before-seen transfer speeds. Applied with the 30µ" gold finger PCB and Corner Bond technology, the MTE370T is fully tested in-house to guarantee reliability in mission-critical applications, boasting an endurance rating of 3K Program/Erase cycles and an extended operating temperature ranging from -20℃~75℃. More information: Operational conditions | Operating temperature (T-T) | -20 - 75 °C | | Storage temperature (T-T) | -55 - 75 °C | | Minimum operating temperature | -20 °C | | Maximum operating temperature | 75 °C | | Operating relative humidity (H-H) | 5 - 95 % | | Operating vibration | 20 G | | Operating shock | 1500 G | Power | Operating voltage | 3.3 V | | Power consumption (idle) | 0.4 W | Features | SSD form factor | M.2 | | SSD capacity | 512 GB | | Interface | PCI Express 3.0 | | Memory type | 3D NAND | | NVMe | Yes | | Component for | Laptop | | NVMe version | 1.3 | | Read speed | 2000 MB/s | | Write speed | 1100 MB/s | | Random read (4KB) | 90000 IOPS | | Random write (4KB) | 220000 IOPS | | M.2 key ID | M | | PCI Express interface data lanes | x4 | | S.M.A.R.T. support | Yes | | TRIM support | Yes | | ECC | Yes | | Native Command Queuing (NCQ) | Yes | | Mean time between failures (MTBF) | 3000000 h | | TBW rating | 480 | | Certification | CE, FCC, BSMI, UKCA | Weight & dimensions | Width | 22 mm | | Depth | 30 mm | | Height | 2.38 mm | | Weight | 4 g |
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