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| Item number: CIEN3-76974138 Manufacturer no.: 51644 EAN/GTIN: 5901878516448 |
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| Efficient thermally conductive paste, characterized by both high thermal conductivity and high insulation. Perfectly fills the connections and micro-gaps between the processor and the basis of the cooling system. The paste is very easy to apply. It can be used for a long time without having to be replaced. It does not lose its properties. More information: Features | Thermal conductivity | 3.05 W/m·K | | Thermal resistance | 0.073 °C/W | Weight & dimensions | Weight | 100 g |
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| Other search terms: thermal compound, thermal grease, thermal greases, heat sink compound, heat sink compounds |
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