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Qoltec 51641 heat sink compound 3.05 W/m·K 0.5 g


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Product information
Qoltec 51641 heat sink compound 3.05 W/m·K 0.5 g
Qoltec 51641 heat sink compound 3.05 W/m·K 0.5 g
Item number:
     CIEN3-74285787
Manufacturer:
     Qoltec
Manufacturer no.:
     51641
EAN/GTIN:
     5901878516417
Search terms:
Thermal compound
Thermal paste
Thermal grease
thermal compound
Efficient thermally conductive paste, characterized by both high thermal conductivity and high insulation. Perfectly fills the connections and micro-gaps between the processor and the basis of the cooling system. The paste is very easy to apply. It can be used for a long time without having to be replaced. It does not lose its properties.
More information:
Features
Thermal conductivity
3.05 W/m·K
Product colour
Gold
Thermal resistance
0.073 °C/W
Weight & dimensions
Weight
0.5 g
Other search terms: thermal grease, thermal greases, heat sink compound, heat sink compounds
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from £ 0.85*
  
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