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Thermaltake TG-4 heat sink compound 3.3 W/m·K 1.5 g


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Product information
Thermaltake TG-4 heat sink compound 3.3 W/m·K 1.5 g
Thermaltake TG-4 heat sink compound 3.3 W/m·K 1.5 g
Thermaltake TG-4 heat sink compound 3.3 W/m·K 1.5 g
Thermaltake TG-4 heat sink compound 3.3 W/m·K 1.5 g
Item number:
     CIEN3-21606043
Manufacturer:
     Thermaltake
Manufacturer no.:
     CL-O001-GROSGM-A
EAN/GTIN:
     4717964392435
Search terms:
Thermal compound
Thermal paste
Thermal grease
thermal compound
Thermaltake high performance and exceptional reliability Thermal grease, to maximize heat transfer by eliminating the minuite air gap between the heat source and the heat sink caused by their irregular surfaces.

High Thermal Conductivity
Lighter, easier to spread stable composition won’t crack or dry out, delivering excellent long-lasting thermal conductivity.

High Fluidity
Producing an even layer with high fluidity when using applicator.

Long life span
More effective than standard silicon-based heat grease/CPU paste, providing optimum protection against CPU heat damage for a long life span usage.

Made for Extreme Performance
TG-4 is optimized for use between modern high-power CPUs and high-performance heatsinks or water-cooling solutions.

Easy to use
Easy to use on the contact surface of the heatsink to improve the heat dissipation of the processor
More information:
Features
Thermal conductivity
3.3 W/m·K
Product colour
Grey
Operating temperature (T-T)
-50 - 250 °C
Weight & dimensions
Width
71 mm
Depth
16.3 mm
Height
120.5 mm
Weight
1.5 g
Other search terms: thermal grease, thermal greases, heat sink compound, heat sink compounds
An overview of the conditions1
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Price
£ 14.30*
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