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Xilence ZUB-XPTP.X5 heat sink compound 5.15 W/m·K 3 g


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Product information
Xilence ZUB-XPTP.X5 heat sink compound 5.15 W/m·K 3 g
Xilence ZUB-XPTP.X5 heat sink compound 5.15 W/m·K 3 g
Item number:
     CIEN0-49109770
Manufacturer:
     Xilence
Manufacturer no.:
     XZ019
EAN/GTIN:
     4044953106941
Search terms:
Heatsink
Heatsinks
Heat sink
Heat sinks
Xilence X5 thermal paste was specifically designed for high-end processors. The very high thermal conductivity ensures for an efficient heat exchange and low temperatures! The paste works reliably at temperatures from -50 to +300°C – therefore, it is particularly well suited for extreme overclocking. Since the X5 is not electrically conductive, there is no danger for the surrounding hardware! Contents: 2.5 g.
More information:
Features
Thermal conductivity
5.15 W/m·K
Product colour
Black, Red, White
Viscosity note
73 CPS
Thermal resistance
0.201 °C/W
Operating temperature (T-T)
-30 - 280 °C
Certification
CE
Packaging data
Package width
120 mm
Package depth
20 mm
Package height
10 mm
Weight & dimensions
Weight
3 g
Technical details
Sustainability certificates
RoHS
Other search terms: Thermal compound, Thermal paste, Thermal grease, thermal compound, thermal grease, thermal greases, heat sink compound, heat sink compounds
An overview of the conditions1
Delivery period
Stock level
Price
£ 5.50*
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