Product range
My Mercateo
Sign in / Register
Basket
 
 

Heatsink: extruded; grilled; BGA,FPGA; black; L: 23mm; W: 23mm


Quantity:  pieces  
Product information

Item number:
     5070-374224B60023G
Manufacturer:
     BOYD CORP
Manufacturer no.:
     374224B60023G
EAN/GTIN:
     n/a
Search terms:
FPGA
Field-programmable gate array
Heatsink
Heatsinks
Manufacturer: BOYD CORP
Colour: black
Width: 23mm
Material: aluminium
Height: 25mm
Length: 23mm
Application: BGA;FPGA
Type of heatsink: extruded
Heatsink shape: grilled
Material finishing: anodized
An overview of the conditions1
Delivery period
Stock level
Price
from £ 2.46*
  
Price is valid from 105,000 pieces
Minimum order quantity: 210 pieces
Select conditions yourself
Share itemAdd item to shopping list
Staggered prices
Order quantity
Net
Gross
Unit
from 210 pieces
£ 2.68*
£ 3.22
per piece
from 420 pieces
£ 2.66*
£ 3.19
per piece
from 1050 pieces
£ 2.63*
£ 3.16
per piece
from 2100 pieces
£ 2.59*
£ 3.11
per piece
from 105000 pieces
£ 2.46*
£ 2.95
per piece
* Prices with asterisk are net prices excl. statutory VAT.
Our offer is only aimed at companies, public institutions and freelancers.