Product range
United Kingdom
English
My Mercateo
Sign in / Register		Basket
 		 
 >  >  >  >  >  > Item

Heatsink: extruded; BGA,FPGA; L: 23mm; W: 23mm; H: 25mm; aluminium


Quantity:  pieces  
Product information

Item number:
     5070-374224B00035G
Manufacturer:
     BOYD CORP
Manufacturer no.:
     374224B00035G
EAN/GTIN:
     n/a
Search terms:
FPGA
Field-programmable gate array
Heatsink
Heatsinks
Manufacturer: BOYD CORP
Width: 23mm
Material: aluminium
Height: 25mm
Length: 23mm
Application: BGA;FPGA
Type of heatsink: extruded
An overview of the conditions1
Delivery period
Stock level
Price
from £ 1.62*
  
Price is valid from 210,000 pieces
Minimum order quantity: 420 pieces
Select conditions yourself
Share itemAdd item to shopping list
Staggered prices
Order quantity
Net
Gross
Unit
from 420 pieces
£ 1.76*
£ 2.11
per piece
from 2100 pieces
£ 1.72*
£ 2.06
per piece
from 4200 pieces
£ 1.69*
£ 2.03
per piece
from 210000 pieces
£ 1.62*
£ 1.94
per piece
* Prices with asterisk are net prices excl. statutory VAT.
Our offer is only aimed at companies, public institutions and freelancers.