Heatsink: extruded; BGA,FPGA; L: 35mm; W: 35mm; H: 27.9mm; aluminium purchased inexpensively from Mercateo

Product information

Item number:
5070-372024B00032G

Manufacturer:
BOYD CORP

Manufacturer no.:
372024B00032G

EAN/GTIN:
n/a

Search terms:

Heatsink
Heatsinks
Heat sink
Heat sinks

Manufacturer: BOYD CORP
Width: 35mm
Material: aluminium
Height: 27.9mm
Length: 35mm
Application: BGA;FPGA
Type of heatsink: extruded

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Other search terms: Extruded heat sink, Extruded heat sinks, Extruded heatsink, Extruded heatsinks, extruded heat sinks