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| Item number:
2794E-7524887 Manufacturer no.:
HF650P-0.001-01-1112-NA EAN/GTIN:
n/a |
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| Hi-Flow 650P. Hi-Flow® 650P is a thermally conductive phase change material, reinforced with a polyimide film that is naturally tacky on one side. The polyimide film provides a high dielectric strength and high cut through resistance. Hi-Flow® 650P offers high temperature reliability ideal for automotive applications. Hi-Flow® 650P is designed for use between a high-power electrical device requiring electrical isolation from the heat sink and is ideal for automated dispensing systems. Typical applications include spring / clip-mounted devices and discrete power semiconductors and modules. Thermal Impedance: 0.20°C-in2/W (@25 psi) 150°C high temperature reliability Natural tack one side for ease of assembly Exceptional thermal performance in an insulated pad More information: | | Dimensions: | 11 x 12in | Thickness: | 0.001in | Length: | 11in | Width: | 12in | Thermal Conductivity: | 1.5W/m·K | Material: | Hi-Flow 650P | Self-Adhesive: | Yes | Minimum Operating Temperature: | -40°C | Maximum Operating Temperature: | +150°C | Material Trade Name: | Hi-Flow 650P | Operating Temperature Range: | -40 → +150 °C |
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| Other search terms: All-purpose adhesive, All-purpose adhesives, Heatsink Thermal Pad, Heatsink Thermal Pads, Cooling Thermo Pad, Cooling Thermo Pads, Thermal interface pad, Thermal interface pads, Thermal interface sheet, Thermal interface sheets, all-purpose glue, 7524887, HVAC, Fans & Thermal Management, Electronics Heating & Cooling Components, Thermal Pads, Bergquist, HF650P0001011112NA |
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