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Bergquist Self-Adhesive Thermal Interface Pad, 0.001in Thick, 1.5W/m·K, Hi-Flow 650P / 7524881


Quantity:  packet  
Product information
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Item number:
     2794E-7524881
Manufacturer:
     Bergquist
Manufacturer no.:
     HF650P-0.001-01-00-54
EAN/GTIN:
     n/a
Search terms:
All-purpose glue
All-purpose glues
Universal glue
Universal glues
Hi-Flow 650P. Hi-Flow® 650P is a thermally conductive phase change material, reinforced with a polyimide film that is naturally tacky on one side. The polyimide film provides a high dielectric strength and high cut through resistance. Hi-Flow® 650P offers high temperature reliability ideal for automotive applications. Hi-Flow® 650P is designed for use between a high-power electrical device requiring electrical isolation from the heat sink and is ideal for automated dispensing systems. Typical applications include spring / clip-mounted devices and discrete power semiconductors and modules. Thermal Impedance: 0.20°C-in2/W (@25 psi) 150°C high temperature reliability Natural tack one side for ease of assembly Exceptional thermal performance in an insulated pad
More information:
Thickness:
0.001in
Thermal Conductivity:
1.5W/m·K
Material:
Hi-Flow 650P
Self-Adhesive:
Yes
Minimum Operating Temperature:
-40°C
Maximum Operating Temperature:
+150°C
Material Trade Name:
Hi-Flow 650P
Operating Temperature Range:
-40 → +150 °C
An overview of the conditions1
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Price
£ 45.05*
1 packet contains 50 pieces (£ 0.901* per piece)
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