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| Item number: 2794E-7524881 Manufacturer no.: HF650P-0.001-01-00-54 EAN/GTIN: n/a |
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| Hi-Flow 650P. Hi-Flow® 650P is a thermally conductive phase change material, reinforced with a polyimide film that is naturally tacky on one side. The polyimide film provides a high dielectric strength and high cut through resistance. Hi-Flow® 650P offers high temperature reliability ideal for automotive applications. Hi-Flow® 650P is designed for use between a high-power electrical device requiring electrical isolation from the heat sink and is ideal for automated dispensing systems. Typical applications include spring / clip-mounted devices and discrete power semiconductors and modules. Thermal Impedance: 0.20°C-in2/W (@25 psi) 150°C high temperature reliability Natural tack one side for ease of assembly Exceptional thermal performance in an insulated pad More information: | | Thickness: | 0.001in | Thermal Conductivity: | 1.5W/m·K | Material: | Hi-Flow 650P | Self-Adhesive: | Yes | Minimum Operating Temperature: | -40°C | Maximum Operating Temperature: | +150°C | Material Trade Name: | Hi-Flow 650P | Operating Temperature Range: | -40 → +150 °C |
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| Other search terms: All-purpose adhesive, All-purpose adhesives, Adhesive putty, Adhesive gum, Adhesive putty tabs, Sticky putty, Removable adhesive putty, Reusable adhesive putty, Adhesive pads, Adhesive pad, Heatsink Thermal Pad, Heatsink Thermal Pads, Cooling Thermo Pad, Cooling Thermo Pads, Thermal interface pad, Thermal interface pads, Thermal interface sheet, Thermal interface sheets, adhesive gum, 7524881, HVAC, Fans & Thermal Management, Electronics Heating & Cooling Components, Thermal Pads, Bergquist, HF650P0001010054 |
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