|  |
| |
| Item number:
2794E-1962768 Manufacturer no.:
1-2204749-8 EAN/GTIN:
n/a |
| |
|
| | |
| The TE Connectivity’s (TE) ELCON Micro wire-to-board power components provides a high current up to 12.5A per pin in the common industry footprint of 3.0mm. This current density is useful for servers, switches, storage devices and testing machines in a compact design. The TE ELCON Micro wire-to-board power perform reliably in harsh environments with maximum operating temperature of 105 °C.Support 2 to 24 pin configurations Supports different currents with multiple combinations of different wire sizes PCB footprint compatible with other suppliers Easy assembly with virtually fool-proof mating features Made with halogen-free material More information: | | Insulation: | Insulated | Minimum Wire Size (AWG): | 20AWG | Maximum Wire Size (AWG): | 24AWG | Contact Plating: | Tin |
|
| | |
| | | |
| Other search terms: female crimp contact, 1962768, Connectors, Wire Terminals & Splices, Crimp Pin Connectors, TE Connectivity, 122047498 |
| | |
| |