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| Item number:
2794E-1944684 Manufacturer no.:
520005402 EAN/GTIN:
n/a |
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| SILCOTHERM 2 Part Addition cure silicone encapsulantThermally conductive Low modulus 1:1 Mix Ratio More information: | | Trade Name: | QSil 553 | Product Material: | Silicone | Package Type: | Kit | Package Size: | 2 L | Special Properties: | Thermal Conductivity | Cure Time: | 24 h @ 25 °C, 7 min @ 100°C | Thermal Conductivity: | 0.68W/mK | Maximum Operating Temperature: | +260°C | Minimum Operating Temperature: | -55°C | Operating Temperature Range: | -55 → +260 °C | Physical Form: | Viscous Liquid | Viscosity Measurement: | 6000mPa/s | Volume Resistivity: | 4.02E+14Ω cm |
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| Other search terms: potting compound, 1944684, Adhesives, Sealants & Tapes, Sealants & Resins, Potting Compounds, Acc Silicones, 520005402 |
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