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| Item number:
2794E-1882657 Manufacturer no.:
W29N08GZBIBA EAN/GTIN:
5059045377108 |
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| Density : 8Gbit (2 chip stacked solution) Vcc : 1.7V to 1.95V Bus width : x8/x16 Operating temperature Industrial: -40°C to 85°C Single-Level Cell (SLC) technology. Organization Density: 8G-bit/1G-byte Page size 2,112 bytes (2048 + 64 bytes) 1,056 words (1024 + 32 words) Block size 64 pages (128K + 4K bytes) 64 pages (64K + 2K words) Highest Performance Read performance (Max.) Random read: 25us Sequential read cycle: 35ns Write Erase performance Page program time: 250us(typ.) Block erase time: 2ms(typ.) Endurance 100,000 Erase/Program Cycles(1) 10-years data retention Command set Standard NAND command set Additional command support Copy Back Two-plane operation Contact Winbond for OTP feature Contact Winbond for Block Lock feature Lowest power consumption Read: 13mA(typ.) Program/Erase: 13mA(typ.) CMOS standby: 20uA(typ.) Space Efficient Packaging 48-pin standard TSOP1 63-ball VFBGA8Gb SLC NAND Flash Memory with uniform 2KB+64B page size.Bus Width: x8 Random Read: 25us Page Program Time: 250us(typ.) Block Erase Time: 2ms(typ.) Support OTP Memory Area More information: | | Memory Size: | 8Gbit | Interface Type: | Parallel | Package Type: | VFBGA | Pin Count: | 63 | Organisation: | 1024K x 8 bit | Mounting Type: | Surface Mount | Cell Type: | SLC NAND | Minimum Operating Supply Voltage: | 1.7 V | Maximum Operating Supply Voltage: | 1.95 V | Block Organisation: | Symmetrical | Length: | 11.1mm | Height: | 0.6mm | Width: | 9.1mm | Dimensions: | 11.1 x 9.1 x 0.6mm | Maximum Operating Temperature: | +85 °C |
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| Other search terms: 1882657, Semiconductors, Memory Chips, Flash Memory, Winbond, W29N08GZBIBA |
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