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| Item number: 2794E-1859625 Manufacturer no.: MICROFJ-40035-TSV-TR1 EAN/GTIN: n/a |
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| High-density microcells J-Series sensors feature ON Semiconductors unique fast output terminal Temperature stability of 21.5 mV/°C Exceptional breakdown voltage uniformity of ±250 mV Available in a reflow solder compatible TSV chip-scale package Ultra-low dark count rates of 50 kHz/mm2 typical Optimized for high-performance timing applications, such as ToF-PET 3 mm, 4 mm and 6 mm sensor sizes Bias voltage of <30 V Results in a 50% photon detection efficiency (PDE) at 420 nm Improved signal rise time and the microcell recovery time Negates the need for active voltage control Industry-leading uniformity TSV package results in almost zero deadspace allowing the creation of high fill factor arrays and is ferrous-metal free Applications Medical Imaging Hazard & Threat 3D Ranging & Sensing Biophotonics & Sciences High Energy Physics More information: | | Package Type: | TSV | Amplifier Function: | No | Mounting Type: | Surface Mount | Number of Pins: | 4 | Diode Material: | Si | Minimum Wavelength Detected: | 200nm | Maximum Wavelength Detected: | 900nm | Length: | 4mm | Width: | 4mm | Height: | 0.46mm | Breakdown Voltage: | 24.7V | Series: | J |
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| Other search terms: Photo diode, photo diode, 1859625, Displays & Optoelectronics, Optocouplers & Photodetectors, onsemi, MICROFJ40035TSVTR1 |
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