Density S25FS128S-128 Mbits (16 MB) S25FS256S-256 Mbits (32 MB) Serial Peripheral Interface (SPI) SPI Clock polarity and phase modes 0 and 3 Double Data Rate (DDR) option Extended Addressing: 24- or 32-bit address options Serial Command subset and footprint compatible with S25FL-A, S25FL-K, S25FL-P, and S25FL-S SPI families Multi I/O Command subset and footprint compatible with S25FL-P, and S25FL-S SPI families Read Commands: Normal, Fast, Dual I/O, Quad I/O, DDR Quad I/O Modes: Burst Wrap, Continuous (XIP), QPI Serial Flash Discoverable Parameters (SFDP) and Common Flash Interface (CFI), for configuration information Program 256- or 512-byte Page Programming buffer Program suspend and resume Automatic ECC internal hardware Error Correction Code generation with single-bit error correction Erase Hybrid sector options Physical set of eight 4-KB sectors and one 32-KB sector at the top or bottom of address space with all remaining sectors of 64 KB or Physical set of eight 4-KB sectors and one 224-KB sector at the top or bottom of address space with all remaining sectors of 256 KB Uniform sector options Uniform 64-KB or 256-KB blocks for software compatibility with higher density and future devices Erase suspend and resume Erase status evaluation 100,000 Program-Erase Cycles, minimum 20 Year Data Retention, minimum Security Features One-Time Program (OTP) array of 1024 bytes Block Protection: Status Register bits to control protection against program or erase of a contiguous range of sectors Hardware and software control options Advanced Sector Protection (ASP) Individual sector protection controlled by boot code or password Option for password control of read access Technology Cypress 65 nm MirrorBit® Technology with Eclipse™ Architecture Supply Voltage 1.7V to 2.0V Packages (All Pb-Free) 8-lead SOIC 208 mil (SOC008) — FS128S only WSON 6 x 5 mm (WND008) — FS128S only WSON 6 x 8 mm (WNH008) 16-lead SOIC 300 mil (SO3016 — FS256S only) BGA-24 6 x 8 mm 5 x 5 ball (FAB024) footprint 4 x 6 ball (FAC024) footprint Known Good Die, and Known Tested Die More information:  | | Memory Size: | 128Mbit | Interface Type: | CFI, SPI | Package Type: | SOIC | Pin Count: | 8 | Organisation: | 16M x 8 bit | Mounting Type: | Surface Mount | Cell Type: | NOR | Minimum Operating Supply Voltage: | 1.7 V | Maximum Operating Supply Voltage: | 2 V | Dimensions: | 5.28 x 5.28 x 1.9mm | Maximum Operating Temperature: | +85 °C | Minimum Operating Temperature: | -40 °C | Number of Bits per Word: | 8bit | Number of Words: | 16M |
|