SMD Fuse, Characteristic (time/current): Fast-blow, Construction form: 7.4 x 2.6 x 3.1 mm, Resistance to soldering heat: 260 °C @ 10 s, Series: OMF63, Solderability: 235 °C @ 2 s (reflow and wave soldering), Rated voltage: 63 VAC/DC, Voltage drop: 350 mV More information:  |  | Bruttogewicht: | 0.001 kg | Ursprungsland: | CH |
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