Heat Sink Compounds (67 items)

Filling the Gaps Due to its low hardness and great compressibility, the thermal pad works as the perfect gap filler and bridges uneven surface and gaps without any problems. Easy to Apply ARCTIC's ...

Filling the Gaps Due to its low hardness and great compressibility, the thermal pad works as the perfect gap filler and bridges uneven surface and gaps without any problems. Easy to Apply ARCTIC's ...

Filling the Gaps Due to its low hardness and great compressibility, the thermal pad works as the perfect gap filler and bridges uneven surface and gaps without any problems. Easy to Apply ARCTIC's ...

Filling the Gaps Due to its low hardness and great compressibility, the thermal pad works as the perfect gap filler and bridges uneven surface and gaps without any problems. Easy to Apply ARCTIC's ...

AK-455-5G is a new improved formulated thermal compound that gives hi-performance heat transfer between the CPU and heatsink. Minimised resistance and maximised efficiency truly enables you to get ...

AK-450 is a silver based thermal compound with high thermal conductivity, low bleed and temperature stability. AK-450 is formulated to give hi-performance heat transfer between the CPU and heatsink...

CircuitWorks Heat Sink Grease CircuitWorks Heat Sink Grease silicone compound facilitates heat transfer away from electrical/electronic components. This heavy consistency material is thickened with...

CircuitWorks Boron Nitride Heat Sink Grease CircuitWorks Boron Nitride Heat Sink Grease facilitates heat transfer away from electrical/electronic components and into heat sinks. The material exhibi...

Let in the Cold Thermal Grease Cryofuze Cooler Master is launching a new addition to the CryoFuze Series of thermal paste, CryoFuze Violet. Featuring a purple tinted compound, nanoparticles within ...

Cooler Master HTK-002 thermally conductive compounds are grease-like silicone materials, heavily filled with heat conductive metal oxides. This combination promotes high thermal conductivity, low b...

High Thermal Conductivity Ice Fusion V2 High Insulation. High Temperature Resistance. Toxic Free. Low Volatility Environmental Friendly Uses of materials that is environmental friendly Low volatili...

CORSAIR TM30 thermal paste helps you push your PC to its limit, with a low-viscosity premium zinc oxide thermal material that’s easy to apply. ENTHUSIAST CPU & GPU THERMAL COMPOUND Premium zinc oxi...

ENTHUSIAST CPU & GPU THERMAL COMPOUND Premium zinc oxide-based thermal compound for optimal thermal performance to improve heat transfer and lower temperatures. CORSAIR XTM50 High Performance Therm...

KEEP YOUR COOL SUPERIOR HEAT TRANSFER CORSAIR XTM60 provides exceptional thermal conductivity between your CPU or GPU and your cooler, resulting in improved heat dissipation and significantly lower...

Excellent Thermal Conductivity Z3 thermal gel consists of high thermal conductivity to allow high performance heat dissipation. High Compatibility for Most CPU Cooler Density of Z3 is compatible wi...

Excellent thermal conductivity. - Electrically non-conductive. - Wide range of application temperature.

Thermal compund (grease) for heatsinks Helps the heat dissipation from a CPU, chipset or processor to a heatsink Excellent thermal impedance Perfect stability - will not separate, run, migrate, or ...

Thermal compund (grease) for heatsinks Helps the heat dissipation from a CPU, chipset or processor to a heatsink Excellent thermal impedance Perfect stability - will not separate, run, migrate, or ...

The thermal paste can be used without hesitation in conjunction with a wide range of processors.

Easy and Precise Application! DRIFTIce™ by Iceberg Thermal is easy to apply, precise, and gives you even contact when you’re filling air gaps. Iceberg Thermal Conductivity The thermal conductivity ...

Easy and Precise Application! DRIFTIce™ by Iceberg Thermal is easy to apply, precise, and gives you even contact when you’re filling air gaps. Iceberg Thermal Conductivity The thermal conductivity ...

Easy and Precise Application! DRIFTIce™ by Iceberg Thermal is easy to apply, precise, and gives you even contact when you’re filling air gaps. Iceberg Thermal Conductivity The thermal conductivity ...

Easy and Precise Application! DRIFTIce™ by Iceberg Thermal is easy to apply, precise, and gives you even contact when you’re filling air gaps. Iceberg Thermal Conductivity The thermal conductivity ...

Easy and Precise Application! DRIFTIce™ by Iceberg Thermal is easy to apply, precise, and gives you even contact when you’re filling air gaps. Iceberg Thermal Conductivity The thermal conductivity ...

Easy and Precise Application! DRIFTIce™ by Iceberg Thermal is easy to apply, precise, and gives you even contact when you’re filling air gaps. Iceberg Thermal Conductivity The thermal conductivity ...

Easy and Precise Application! DRIFTIce™ by Iceberg Thermal is easy to apply, precise, and gives you even contact when you’re filling air gaps. Iceberg Thermal Conductivity The thermal conductivity ...

Spare Active CPU Heatsink for Intel® Workstation Boards S2600CR in P4000L-WS Chassis, or 2600COE in P4000M with 150W CPU installed.

NZXT High-performance thermal paste combines thermal conductivity, easy application, and long-term stability to ensure maximum heat transfer when cooling any build.

Noctua's NT-H1 is a pro-grade TIM solution for enthusiasts who demand both exceptional performance and maximum ease of use: A hybrid compound of different micro-particles allows for minimum thermal...

SW (Spatula & Wipes) Edition The SW (Spatula & Wipes) Edition includes a spatula for users who prefer to manually spread the paste before installing the heatsink as well as three NA-CW1 cleaning wi...

Based on the award-winning NT-H1 NT-H2 is based on Noctua’s renowned NT-H1, which has received more than 150 awards and recommendations from international hardware websites and magazines. Chosen ag...

Over the years, Prolimatech PK-1 has become one of the hardware testers’ favorite. It is not hard to see why. PK-1 is a premium grade of thermal compound that is easy to spread and is reliable thro...

When putting down, nothing beats smooth and easy. That is why we created the PK-2 thermal compound. The PK-2 thermal compound is a high performance thermal bonding agent specially designed for easy...

Like two hot lovers, a heatsink and the processor want to make full contact. But microscopic imperfections in their craftsmanship create small gap for air. These gaps act as thermal insulators, inh...

Like two hot lovers, a heatsink and the processor want to make full contact. But microscopic imperfections in their craftsmanship create small gap for air. These gaps act as thermal insulators, inh...

Efficient thermally conductive paste, characterized by both high thermal conductivity and high insulation. Perfectly fills the connections and micro-gaps between the processor and the basis of the ...

Efficient thermally conductive paste, characterized by both high thermal conductivity and high insulation. Perfectly fills the connections and micro-gaps between the processor and the basis of the ...

Efficient thermally conductive paste, characterized by both high thermal conductivity and high insulation. Perfectly fills the connections and micro-gaps between the processor and the basis of the ...

Efficient thermally conductive paste, characterized by both high thermal conductivity and high insulation. Perfectly fills the connections and micro-gaps between the processor and the basis of the ...

Efficient thermally conductive paste, characterized by both high thermal conductivity and high insulation. Perfectly fills the connections and micro-gaps between the processor and the basis of the ...

Efficient thermally conductive paste, characterized by both high thermal conductivity and high insulation. Perfectly fills the connections and micro-gaps between the processor and the basis of the ...

Efficient thermally conductive paste, characterized by both high thermal conductivity and high insulation. Perfectly fills the connections and micro-gaps between the processor and the basis of the ...

Efficient thermally conductive paste, characterized by both high thermal conductivity and high insulation. Perfectly fills the connections and micro-gaps between the processor and the basis of the ...

Efficient thermally conductive paste, characterized by both high thermal conductivity and high insulation. Perfectly fills the connections and micro-gaps between the processor and the basis of the ...

Efficient thermally conductive paste, characterized by both high thermal conductivity and high insulation. Perfectly fills the connections and micro-gaps between the processor and the basis of the ...

Efficient thermally conductive paste, characterized by both high thermal conductivity and high insulation. Perfectly fills the connections and micro-gaps between the processor and the basis of the ...

Efficient thermally conductive paste, characterized by both high thermal conductivity and high insulation. Perfectly fills the connections and micro-gaps between the processor and the basis of the ...

Efficient thermally conductive paste, characterized by both high thermal conductivity and high insulation. Perfectly fills the connections and micro-gaps between the processor and the basis of the ...

Efficient thermally conductive paste, characterized by both high thermal conductivity and high insulation. Perfectly fills the connections and micro-gaps between the processor and the basis of the ...

Efficient thermally conductive paste, characterized by both high thermal conductivity and high insulation. Perfectly fills the connections and micro-gaps between the processor and the basis of the ...

Efficient thermally conductive paste, characterized by both high thermal conductivity and high insulation. Perfectly fills the connections and micro-gaps between the processor and the basis of the ...

Efficient thermally conductive paste, characterized by both high thermal conductivity and high insulation. Perfectly fills the connections and micro-gaps between the processor and the basis of the ...

Efficient thermally conductive paste, characterized by both high thermal conductivity and high insulation. Perfectly fills the connections and micro-gaps between the processor and the basis of the ...

Efficient thermally conductive paste, characterized by both high thermal conductivity and high insulation. Perfectly fills the connections and micro-gaps between the processor and the basis of the ...

Efficient thermally conductive paste, characterized by both high thermal conductivity and high insulation. Perfectly fills the connections and micro-gaps between the processor and the basis of the ...

Thermal glue is an ideal way to attach the heat sink on bridges, memory bands and resistors. The adhesive connection is durable and guarantees excellent thermal conductivity.

Efficient thermally conductive paste, characterized by both high thermal conductivity and high insulation. Perfectly fills the connections and micro-gaps between the processor and the basis of the ...

Efficient thermally conductive paste, characterized by both high thermal conductivity and high insulation. Perfectly fills the connections and micro-gaps between the processor and the basis of the ...

Spire SilverGrease Pro is a high performance, silver based composite thermal interface material designed to maximize heat transfer from processors to heat-sink enabling you to get more cooling perf...

Thermaltake high performance and exceptional reliability Thermal grease, to maximize heat transfer by eliminating the minuite air gap between the heat source and the heat sink caused by their irreg...

Thermaltake TG-7 Thermal Grease Thermaltake high performance and reliable Thermal grease with diamond powder inside for best thermal conductivity, maximizing heat transfer by eliminating the air ga...