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  Heat Sink Compounds (68 items)

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Intel AUPSRCBTA heat sink compound (1 offer) 
Spare Active CPU Heatsink for Intel® Workstation Boards S2600CR in P4000L-WS Chassis, or 2600COE in P4000M with 150W CPU installed.
Intel
AUPSRCBTA
£ 84.57*
per piece
NZXT BA-TP003-01 heat sink compound Thermal paste 6.3 W/m·K 3 g (2 offers) 
NZXT High-performance thermal paste combines thermal conductivity, easy application, and long-term stability to ensure maximum heat transfer when cooling any build.
NZXT
BA-TP003-01
£ 8.03*
per piece
Noctua NT-H1 heat sink compound 1.4 g (3 offers) 
Noctua's NT-H1 is a pro-grade TIM solution for enthusiasts who demand both exceptional performance and maximum ease of use: A hybrid compound of different micro-particles allows for minimum thermal...
noctua
NT-H1
£ 11.72*
per piece
Noctua NT-H1 heat sink compound Thermal paste 3.5 g (1 offer) 
SW (Spatula & Wipes) Edition The SW (Spatula & Wipes) Edition includes a spatula for users who prefer to manually spread the paste before installing the heatsink as well as three NA-CW1 cleaning wi...
noctua
NT-H1 3.5G SW EDITION
£ 14.02*
per piece
noctua
NT-H2-10
£ 28.35*
per piece
Noctua NT-H2 heat sink compound 3.5 g (3 offers) 
Based on the award-winning NT-H1 NT-H2 is based on Noctua’s renowned NT-H1, which has received more than 150 awards and recommendations from international hardware websites and magazines. Chosen ag...
noctua
NT-H2-3
£ 15.18*
per piece
Prolimatech PK-1 Thermal Compound heat sink compound 5 g (2 offers) 
Over the years, Prolimatech PK-1 has become one of the hardware testers’ favorite. It is not hard to see why. PK-1 is a premium grade of thermal compound that is easy to spread and is reliable thro...
ProlimaTech
PK-1 - 5G
£ 13.64*
per piece
Prolimatech PK-2 heat sink compound 10.2 W/m·K 30 g (1 offer) 
When putting down, nothing beats smooth and easy. That is why we created the PK-2 thermal compound. The PK-2 thermal compound is a high performance thermal bonding agent specially designed for easy...
ProlimaTech
PK-2 - 30G
£ 27.43*
per piece
Prolimatech PK-3 1.5g heat sink compound 11.2 W/m·K (1 offer) 
Like two hot lovers, a heatsink and the processor want to make full contact. But microscopic imperfections in their craftsmanship create small gap for air. These gaps act as thermal insulators, inh...
ProlimaTech
PK-3 - 1G
£ 20.25*
per piece
Prolimatech PK-3 5g heat sink compound 11.2 W/m·K (2 offers) 
Like two hot lovers, a heatsink and the processor want to make full contact. But microscopic imperfections in their craftsmanship create small gap for air. These gaps act as thermal insulators, inh...
ProlimaTech
PK-3 - 5G
£ 16.11*
per piece
Qoltec 51630 heat sink compound (1 offer) 
Efficient thermally conductive paste, characterized by both high thermal conductivity and high insulation. Perfectly fills the connections and micro-gaps between the processor and the basis of the ...
Qoltec
51630
£ 0.89*
per piece
Qoltec 51631 heat sink compound (1 offer) 
Efficient thermally conductive paste, characterized by both high thermal conductivity and high insulation. Perfectly fills the connections and micro-gaps between the processor and the basis of the ...
Qoltec
51631
£ 1.33*
per piece
Qoltec 51633 heat sink compound (1 offer) 
Efficient thermally conductive paste, characterized by both high thermal conductivity and high insulation. Perfectly fills the connections and micro-gaps between the processor and the basis of the ...
Qoltec
51633
£ 3.12*
per piece
Qoltec 51634 heat sink compound (1 offer) 
Efficient thermally conductive paste, characterized by both high thermal conductivity and high insulation. Perfectly fills the connections and micro-gaps between the processor and the basis of the ...
Qoltec
51634
£ 6.53*
per piece
Qoltec 51635 heat sink compound (1 offer) 
Efficient thermally conductive paste, characterized by both high thermal conductivity and high insulation. Perfectly fills the connections and micro-gaps between the processor and the basis of the ...
Qoltec
51635
£ 1.38*
per piece
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* Prices with asterisk are net prices excl. statutory VAT.
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