Heat Sink Compounds (15 items)

Ensure optimum thermal conductivity with our award winning thermal interfaces. Well known for its outstanding quality, our high-performance MX thermal compound is a regular winner in performance te...

Ensure optimum thermal conductivity with our award winning thermal interfaces. Well known for its outstanding quality, our high-performance MX thermal compound is a regular winner in performance te...

Ensure optimum thermal conductivity with our award winning thermal interfaces. Well known for its outstanding quality, our high-performance MX thermal compound is a regular winner in performance te...

Thermal Pad High Performance Thermal Pad The ARCTIC Thermal Pad provides an efficient thermal interface between heat sinks and electronic devices where uneven surface topography, air gaps and rough...

High-Density Polysynthetic Silver Thermal Compound With its unique high-density filling of micronized silver and enhanced thermally conductive ceramic particles, Arctic Silver 5 provides a new leve...

High Thermal Conductivity Compound High Quality That Runs Your Computer Smoothly MasterGel Pro V2, an upgraded compound of its old version with high CPU/GPU conductivity, providing better heat diss...

Pactum 4 4 g The Pactum 4 4 g is no ordinary paste. It’s the crème de la paste among thermal butters – 4 g of low temperatures in a tube that’ll last you years. Welcome to the glorious era of air p...

NZXT High-performance thermal paste combines thermal conductivity, easy application, and long-term stability to ensure maximum heat transfer when cooling any build.

NT-H2 is the further improved second generation of Noctua’s award-winning hybrid thermal compound. Combining the iconic NT-H1’s proven features, superb ease-of-use and renowned long-term stability ...

The HEATGREASE20 CPU Thermal Paste Compound can be used to improve the effectiveness of a CPU cooler, by thermally bonding the surface of the CPU to the heatsink, which enables the heatsink and fan...

Improves heat transfer between a CPU/chipset and heatsink with easy-to-use thermal pads This 5 pack of Thermal Pads offers a suitable alternative to using heatsink paste/grease. The thermal pads re...

Re-sealable Syringe | Thermal Conductivity: 3.195 W/m-K at 25 °C or greaterThis thermal paste works with a heat sink to improve heat dissipation from integrated computer chips such as CPUs. The the...

5-Pack | Re-sealable Syringes | Thermal Conductivity: 1.93 W/m-K at 25 °C or greaterThis 5-Pack of thermal paste works with a heat sink to improve heat dissipation from integrated computer chips su...

TG-30 is a premium thermal compound for high standard cooling performance designed to lower CPU temperatures effectively. High Thermal Conductivity The thermal compound contains diamond powder, whi...