Heatsink Compounds (6 items)

Dow Corning DC 340 heat sink compound is a white, non-curing and non-flowing thermally conductive compound for improving the thermal coupling of an electrical or electronic devices to a heat sink. ...

This heat transfer compound from Electrolube is a non-melting, non-hardening compound with high thermal conductivity and is ideal for thermal coupling of components.

This heat transfer compound from Electrolube is a non-melting, non-hardening compound with high thermal conductivity and is ideal for thermal coupling of components.

Electrolube HTCP is a highly thermally conductive non-curing heat transfer paste, designed for use as a thermal interface material. It is recommended where large amounts of heat need to be dissipat...

Electrolube HTSP is a highly thermally conductive non-curing heat transfer paste, designed for use as a thermal interface material.It is recommended where large amounts of heat need to be dissipate...

This Kontakt Chemie 32044-AB Heat Sink Compound is used to increase the thermal conductivity and the efficient heat dissipation of electronic components.